2024
- Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating. Laser 3D Manufacturing XI, SPIE, 2024 more… Full text ( DOI )
2023
- Investigations on processing copper-titanium powder blends via PBF-LB/M. Laser in Manufacturing Conference 2023, 2023 more… Full text (mediaTUM)
- Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), IEEE, 2023 more… Full text ( DOI )
2022
- Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022 more… Full text ( DOI )
- Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), IEEE, 2022 more… Full text ( DOI )
- Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF). Laser 3D Manufacturing IX, SPIE, 2022 more… Full text ( DOI )
- Strahlformung eröffnet neue Perspektiven im Metall-3-D-Druck. maschinenbau 2 (6), 2022, 8-11 more… Full text ( DOI )
2020
- A New Development of Micro-Copper Sinter Material for High Power Electronics Application. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020 more…
- Process development for laser powder bed fusion of pure copper. Laser 3D Manufacturing VII, SPIE, 2020 more… Full text ( DOI )
2019
- Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes. 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), IEEE, 2019 more… Full text ( DOI )
- A novel approach of copper-ceramic-joints manufactured by selective laser melting. Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems IV, SPIE, 2019 more… Full text ( DOI )
2018
- The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges. Optics and Photonics for Information Processing XII, SPIE, 2018 more… Full text ( DOI )
- INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH. , 2018 more…
- Electrical and Mechanical Qualification of Selectively Dispensed Active Brazes. 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, 2018 more… Full text ( DOI )
- Additive Manufacturing of 3D-copper-metallizations on alumina by means of Selective Laser Melting for power electronic applications. CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, 2018 more…
2017
- Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes. International Symposium on Microelectronics 2017 (1), 2017, 000761-000767 more… Full text ( DOI )
2016
- Investigations in selective laser melting as manufacturing technology for the production of high-temperature mechatronic integrated devices. 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), IEEE, 2016 more… Full text ( DOI )
- Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects. 2016 12th International Congress Molded Interconnect Devices (MID), IEEE, 2016 more… Full text ( DOI )