Sensor-integrating Gear (SIZA) SPP 2305

Project Description

The potential damage of gears results directly or indirectly from the physical processes of tooth engagement. For the most reliable condition monitoring possible, the aim is to acquire measurement data as close as possible to the tooth engagement; ideally, suitable sensors should be integrated directly into the gear "in-situ". Therefore, the aim of the research is the integration of sensors and electronics including algorithms for data acquisition at the point of interest (in-situ) in the machine element gear. The data is pre-processed, transmitted to a central system and can thus be used to determine the condition of the gear. For this purpose sensors and electronics are integrated into a gear. The data generated in the sensor-integrated gear (SIZA) is processed, analyzed and transmitted using energy-efficient and real-time processing and analysis. Computing processes are distributed on-board and off-board using wireless energy and data interfaces as required. Furthermore, the SIZA is modeled as an overall system to enable holistic optimization and evolution. The research includes the determination of requirements for a SIZA with regard to sensor technology, electronics, environment and algorithms. With HiL investigations and experimental reference tests, the boundary and environmental conditions are evaluated. Data and algorithms are examined based on their online evaluability. Research and design of sensors, electronics and algorithms including software, hardware and integration interfaces are carried out. The findings are used for the design of a demonstrator SIZA and tested in test rig trials. The aim is to derive fundamental findings, interrelationships and requirements for a sensor-integrated gear that enables demand-oriented measurement in the gear.

Project Partners

  • Technical University of Munich, Institute of Automation and Information Systems
  • Technical University of Munich, Institute of Machine Elements
  • Technical University of Munich, Chair of Circuit Design

Funding

The project is funded by the German Research Foundation (DFG) as part of the SPP2305.